Componentes semiconductorum processione procedura complex a et intricate est quae multi gradibus et technologiis involvet. The cutting methods in semiconductor component processing mainly include the following: 9332;Blade cutting · Full cutting: Fully cutting the workpiece by cutting to a fixed material (such as cutting tape) is a basic processing method in semiconductor manufacturing· Half cut: Cutting in to the middle of the work piece to create a groove, commonly used in DBG technology for thinning and chip separation through grinding. · Double cutting: Use a double cutting saw to perform simultaneously full or half cutting on two lines to increase production· Step by step cutting: using a dual cutting machine with two main axes to perform full cutting and half cutting in two stages, commonly used for processing wiring layers· Diagonal cutus: Durante gradus per gradus cutus procedentiam, scilla cum angulo V formatura in latere semi cutus utilitur ad succidendum wafer in duobus gradibus, attingens fortitudinem mollentem altam et processionem qualitatis Chopper cutting: The blade descends from directly above the workpiece and cuts vertically into the workpiece, commonly used for local slotting· Horizontal movement of chopper: During the chopper cutting process, the work piece is horizontally moved to cut, suitable for partial cutting· Circulae succidentia: Postquam a scissoro secitur, fabrica in formam circularem circumfertur mensam processionis. Tilt cutting (tilt angle spindle): installing a tilted spindle on the machining table to achieve cutting a certain angle, it is used for processes that require cutting angle Laser cutting: Utrum laser technology ad separandum waferum in frumentum est altum concentrationem fluctus photonum in waferum, altam temperaturam regionalem generationem ut exterminem regionem canalorum. Costa laser cutationis relativamente alta est, sed alta precision et alta efficientia procedere potest Micro cutting machining utilizes high-resolution solid micro cutting tools to remove workpiece allowance through mechanical force on precision and ultra precision cutting machines The processing materials are extensive, the processing shapes are complex, and the processing accuracy is high. The processing shapes mainly rely on cutting tools and machine tools to ensure Circulus exterior cutus: Utrum modos anteriores cutus, cutus ex rotacio velocitatis bladii in conjuncto cum ingresso silicon is formatur. A causa limitationum methodos clampionis et stipendia exterioris circularis, precisa et flatitudo redundata sunt, graduam alteris methodos replicata sunt. Metodos supra cutationis unusquisque proprias caracterias habent et sunt adequati ad diversas opus processationis semiconductoris componentibus. In applications practical, it is necessary to select appropriate cutting methods based on specific machining requirements and conditions.