Senyang laser cutus in quattuor categorias divisurus est: vaporizatio laser, conflatio laser, succio oxygeno laser, succio laser et fractura controllo. Exactly!

Collating laser vaporization cutting

Exalta energia densitate laser trabem ut calefaceret laborem velociter temperaturam crescit, coquens punctum materiae in brevi tempore attinget, et materia vaporizat, vaporizat. Velocitate eiectionis vaporis istis altissima est, et simul cum vaporis eiecti sunt, incisiones in materia formantur. Temperatur vaporization is materiae generale alta est, ergo vaporizatio laser magnam magnam magnam magnitudinem potentiae et densitatem potentiae requirit.

Laser vaporization cutting is commonly used for cutting extremely thin metal materials and non-metallic materials such as paper, cloth, wood, plastic and rubber.

Condens laser conflato

Quando laser conflavit succidentem, materia metalla conflavit a calore laser is, et tunc non oxidientes gases (Ar, He, N, etc.) effundentur per trabem coaxial nozzle, reliquus est super pressionem gasae fortem ut discargat metallum liquidum et format succidentem. Laser contaminatio non potuit vaporizationem metalla completam, et solum 1/10 energiae requirit vaporizationis extinguere.

Laser conflatio sublime utilitur ad succidendum materiae aut metallos active non facile oxidizatur, sicut steel stainless, titanium, aluminum et alloys eorum.

Calculatione of laser oxygen cutting

Principus oxygeni laser is secationis similis est oxyacetylene secationis. Laser calamos fons et active gases, sicut oksijen, gases cut. Gas effudit reactionem metallo secentem causantem reactionem oxidationis et relevantem multam calorem oxidationis; On the other hand, blow the molten oxide and molten material out of the reaction zone to form a cut in the metal. A causa reaction is oxidationis during the cutting process, a large amount of heat is generated, so the energy required for laser oxygen cutting is only half of that for melting cutting, and the cutting speed is much faster than laser vaporization cutting and fusing cutting.

Oxygenum laser sequitur primum facile ad materiales metallicos oxidizabilis, sicut ferrum carbonium, ferrum titanium, et ferrum tractatum ferrum.

Folding laser cutting and controlling fracture

Laser scribing est utilis laserorum altissimi energiae densitatis scandalis superficiem materiae brittlium, causantes materiae in parva grova evaporare quando calefactus est, et tunc aliquid pressionem applicans, brittlius materia inter parva grova fractatur. Laseri laser cutationis generale Q-switched lasers et CO2 lasers sunt.

Controlling fracture is the use of the steep temperature distribution generated during laser grooving to create local thermal stress in brittle materials, causing the material to fracture along small grooves.

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