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What should be paid attention to when polishing the surface of semiconductor parts during processing?
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What should be paid attention to when polishing the surface of semiconductor parts during processing?

Release time:2024-11-30     Number of views :


The surface polishing of semiconductor parts processing is a crucial step that directly affects the quality and performance of the parts. When performing surface polishing, attention should be paid to the following aspects: 1. Polishing time and depth control: Excessive polishing may damage the performance of the part, so it is necessary to strictly control the polishing time and depth to ensure that the polishing degree is moderate, achieving the requirement of smooth surface without damaging the internal structure of the part. The selection and quality of polishing solution: The selection and quality of polishing solution directly affect the polishing effect. It is necessary to choose a polishing solution that is suitable for the characteristics of semiconductor materials, and strictly control the formula and purity of the polishing solution to avoid impurities from contaminating or damaging the surface of the parts. 3. Temperature and pressure control: It is necessary to maintain a constant temperature and pressure during the polishing process to ensure the stability of polishing quality. Excessive or insufficient temperature may affect the polishing effect, while uneven pressure may cause scratches or unevenness on the surface of the parts. 4. Electrostatic protection: Semiconductor materials are sensitive to static electricity, so it is necessary to protect the parts from static electricity during the polishing process to prevent damage caused by static electricity. This includes using anti-static equipment and tools, as well as maintaining appropriate humidity and temperature in the work environment. 5. Cleaning and Inspection: After polishing, the parts need to be thoroughly cleaned and inspected to ensure that there are no residual polishing solution and contaminants on the surface of the parts. Appropriate cleaning agents and methods should be used during cleaning to avoid secondary contamination of the parts. At the same time, it is necessary to carefully inspect the surface of the parts using tools such as microscopes to ensure that there are no defects such as scratches or pits.

What should be paid attention to when polishing the surface of semiconductor parts during processing?(pic1)